Kirsten Weide: search on Z-Library

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1

Impact of FEM simulation on reliability improvement of packaging

Journal:

Microelectronics Reliability

Year:

1999

Language:

english

File:

PDF, 861 KB

english, 1999

2

Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures

David Dalleau, Kirsten Weide-Zaage, Yves Danto

Journal:

Microelectronics Reliability

Year:

2003

File:

PDF, 1.27 MB

2003

3

Simulation of packaging under harsh environment conditions (temperature, pressure, corrosion and radiation)

Weide-Zaage, Kirsten

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.71 MB

english, 2017

4

Determination of migration effects in Cu-via structures with respect to process-induced stress

Weide-Zaage, Kirsten, Zhao, Jiani, Ciptokusumo, Joharsyah, Aubel, Oliver

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.13 MB

english, 2008

5

[IEEE 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Dresden, Germany (2017.4.3-2017.4.5)] 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Simulation investigations for the comparison of standard and highly robust AlCu thick metal tracks

Sethu, Raj Sekar, Hein, Verena, Erstling, Marco, Weide-Zaage, Kirsten

Year:

2017

Language:

english

File:

PDF, 26.70 MB

english, 2017

6

Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects

Moujbani, Aymen, Kludt, Jörg, Weide-Zaage, Kirsten, Ackermann, Markus, Hein, Verena, Meinshausen, Lutz

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.29 MB

english, 2013

7

Influence of air gaps on the thermal–electrical–mechanical behavior of a copper metallization

Irina Bauer, Kirsten Weide-Zaage, Lutz Meinshausen

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 724 KB

english, 2011

8

[IEEE 2015 IEEE International Symposium on Electromagnetic Compatibility - EMC 2015 - Dresden, Germany (2015.8.16-2015.8.22)] 2015 IEEE International Symposium on Electromagnetic Compatibility (EMC) - How SI/EMC and reliability issues could interact together in embedded electronic systems?

Weide-Zaage, Kirsten, Moujbani, Aymen, Duchamp, Genevieve, Dubois, Tristan, Verdier, Frederic, Fremont, Helene

Year:

2015

Language:

english

File:

PDF, 1.21 MB

english, 2015

9

Investigation of stress distribution in via bottom of Cu-via structures with different via form by means of submodeling

Johar Ciptokusumo, Kirsten Weide-Zaage, Oliver Aubel

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 1.46 MB

english, 2009

10

[IEEE 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010) - Singapore, Singapore (2010.07.5-2010.07.9)] 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Mechanical characterization of copper based metallizations with different via-bottom geometries

Ciptokusumo, Johar, Weide-Zaage, Kirsten, Aubel, Oliver

Year:

2010

Language:

english

File:

PDF, 729 KB

english, 2010

11

Simulation of migration effects in nanoscaled copper metallizations

Weide-Zaage, Kirsten, Kashanchi, Farzan, Aubel, Oliver

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.34 MB

english, 2008

12

Dynamic void formation in a DD-copper-structure with different metallization geometry

Kirsten Weide-Zaage, David Dalleau, Yves Danto, Helene Fremont

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.72 MB

english, 2007

13

Moisture diffusion in Printed Circuit Boards: Measurements and Finite- Element- Simulations

Kirsten Weide-Zaage, Walter Horaud, Hélène Frémont

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 596 KB

english, 2005

14

Qualification procedure for moisture in embedded capacitors

Frémont, Hélène, Kludt, Jörg, Wade, Massar, Weide-Zaage, Kirsten, Bord-Majek, Isabelle, Duchamp, Geneviève

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 1.16 MB

english, 2014

15

[IEEE 2014 IEEE International Reliability Physics Symposium (IRPS) - Waikoloa, HI, USA (2014.6.1-2014.6.5)] 2014 IEEE International Reliability Physics Symposium - Reliability performance of different layouts of wide metal tracks

Kludt, Jorg, Weide-Zaage, Kirsten, Ackermann, Markus, Kovacs, Christian, Hein, Verena

Year:

2014

Language:

english

File:

PDF, 801 KB

english, 2014

16

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Wednesday 1 October 1997)] Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III - Mechanical stress and electromigration in an aluminum meander structure

Yu, Xiaoying, Weide, Kirsten, Keshavarzi, Ali, Prasad, Sharad, Hartmann, Hans-Dieter

Year:

1997

Language:

english

File:

PDF, 180 KB

english, 1997

17

[IEEE 2018 Pan Pacific Microelectronics Symposium (Pan Pacific) - Big Island, HI, USA (2018.2.5-2018.2.8)] 2018 Pan Pacific Microelectronics Symposium (Pan Pacific) - Process, geometry and stack related reliability of thick ALCU-metal-tracks

Weide-Zaage, Kirsten, Hein, Verena

Year:

2018

Language:

english

File:

PDF, 680 KB

english, 2018

18

[IEEE 2019 Pan Pacific Microelectronics Symposium (Pan Pacific) - Kauai, HI, USA (2019.2.11-2019.2.14)] 2019 Pan Pacific Microelectronics Symposium (Pan Pacific) - New-Automotive -Autonomous Driving Challenges For The Microelectronic Components

Weide-Zaage, Kirsten

Year:

2019

Language:

english

File:

PDF, 284 KB

english, 2019

19

[IEEE 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Montpellier, France (2016.4.18-2016.4.20)] 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Thermal-electric-mechanical simulation of a multilevel metallization system

Liu, Yanpeng, Weide-Zaage, Kirsten

Year:

2016

Language:

english

File:

PDF, 1.19 MB

english, 2016

20

SPIE Proceedings [SPIE Microelectronic Manufacturing - Santa Clara, CA (Sunday 20 September 1998)] Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV - Influence of the material properties on the thermal behavior of a package

Weide, Kirsten, Keck, Christian, Yu, Xiaoying, Prasad, Sharad, Hartmann, Hans-Dieter, Tsujide, Tohru

Year:

1998

Language:

english

File:

PDF, 539 KB

english, 1998

21

[IEEE 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Budapest, Hungary (2015.4.19-2015.4.22)] 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - GEANT4 simulations in terms of radiation hardness of commercially available SRAM

Moujbani, Aymen, Weide-Zaage, Kirsten, Romer, Berthold, Sabath, Frank

Year:

2015

Language:

english

File:

PDF, 1.20 MB

english, 2015

22

Reliability evaluation of tungsten donut-via as an element of the highly robust metallization

Hein, Verena, Erstling, Marco, Sethu, Raj Sekar, Weide-Zaage, Kirsten, Bai, Tianlin

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 2.92 MB

english, 2016

23

SPIE Proceedings [SPIE Microelectronic Manufacturing '99 - Santa Clara, CA (Wednesday 22 September 1999)] In-Line Methods and Monitors for Process and Yield Improvement - Influence of different materials on the thermal behavior of a CDIP-8 ceramic package

Weide, Kirsten, Keck, Christian, Ajuria, Sergio A., Jakubczak, Jerome F.

Year:

1999

Language:

english

File:

PDF, 660 KB

english, 1999

24

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Principles for simulation of barrier cracking due to high stress

Ciptokusumoa, Johar, Weide-Zaagea, Kirsten, Aubelb, Oliver

Year:

2010

Language:

english

File:

PDF, 827 KB

english, 2010

25

Evaluation of two vaginal, uterus sparing operations for pelvic organ prolapse: modified Manchester operation (MM) and sacrospinous hysteropexy (SSH), a study protocol for a multicentre randomized non-inferiority trial (the SAM study)

Schulten, Sascha F. M., Enklaar, Rosa A., Kluivers, Kirsten B., van Leijsen, Sanne A. L., Jansen-van der Weide, Marijke C., Adang, Eddy M. M., van Bavel, Jeroen, van Dongen, Heleen, Gerritse, Maaike B

Journal:

BMC Women's Health

Year:

2019

Language:

english

File:

PDF, 589 KB

english, 2019

26

Static and dynamic analysis of failure locations and void formation in interconnects due to various migration mechanisms

Kirsten Weide-Zaage, David Dalleau, Xiaoying Yu

Journal:

Materials Science in Semiconductor Processing

Year:

2003

Language:

english

File:

PDF, 624 KB

english, 2003

27

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Exemplified calculation of stress migration in a 90nm node via structure

Weide-Zaage, Kirsten

Year:

2010

Language:

english

File:

PDF, 22.57 MB

english, 2010

28

[IEEE 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cracow, Poland (2020.7.5-2020.7.8)] 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Identification of influencing PCB design parameters on thermal performance of a QFN package

Hollstein, Kai, Yang, Lintao, Gao, Yuan, Weide-Zaage, Kirsten

Year:

2020

File:

PDF, 644 KB

2020

29

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Simulation of migration effects in PoP

Weide-Zaage, Kirsten, Helene Fremont,, Linyan Wang,

Year:

2008

Language:

english

File:

PDF, 807 KB

english, 2008

30

[IEEE 2018 Pan Pacific Microelectronics Symposium (Pan Pacific) - Big Island, HI, USA (2018.2.5-2018.2.8)] 2018 Pan Pacific Microelectronics Symposium (Pan Pacific) - “New automotive” — Considerations for reliability, robustness and resilience for CMOS interconnects

Weide-Zaage, Kirsten, Fremont, Helene, Hein, Verena

Year:

2018

Language:

english

File:

PDF, 534 KB

english, 2018

31

[IEEE 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hannover, Germany (2019.3.24-2019.3.27)] 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Layout optimization of CMOS Interconnects for Heating, Cooling and Improved Stress Distribution

Hein, Verena, Weide-Zaage, Kirsten, Yang, Xi

Year:

2019

Language:

english

File:

PDF, 591 KB

english, 2019

32

Electromigration and morphological changes in Ag nanostructures

Chatterjee, Atasi, Bai, T., Edler, Frederik, Tegenkamp, Christoph, Weide-Zaage, Kirsten, Pfnür, Herbert

Journal:

Journal of Physics Condensed Matter

Year:

2018

Language:

english

File:

PDF, 5.50 MB

english, 2018

33

[IEEE 2013 IEEE International Integrated Reliability Workshop (IIRW) - South Lake Tahoe, CA, USA (2013.10.13-2013.10.17)] 2013 IEEE International Integrated Reliability Workshop Final Report - Deformation of octahedron slotted metal tracks

Kludt, Jorg, Weide-Zaage, Kirsten, Ackermann, Markus, Hein, Verena

Year:

2013

Language:

english

File:

PDF, 830 KB

english, 2013

34

[IEEE 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hannover, Germany (2019.3.24-2019.3.27)] 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Electromigration Effects in Corroded BGA

Weide-Zaage, Kirsten, Guedon-Gracia, Alexandrine, Fremont, Helene

Year:

2019

Language:

english

File:

PDF, 431 KB

english, 2019

35

[IEEE 2020 Pan Pacific Microelectronics Symposium (Pan Pacific) - HI, USA (2020.2.10-2020.2.13)] 2020 Pan Pacific Microelectronics Symposium (Pan Pacific) - Advances in Packaging for Emerging Technologies

Hollstein, Kai, Weide-Zaage, Kirsten

Year:

2020

File:

PDF, 682 KB

2020

36

SPIE Proceedings [SPIE Microelectronic Manufacturing '95 - Austin, TX, United States (Wednesday 25 October 1995)] Microelectronic Manufacturing Yield, Reliability, and Failure Analysis - Temperature and current density distributions in via structures with inhomogenous step coverages

Weide, Kirsten, Ullmann, Jens

Year:

1995

Language:

english

File:

PDF, 478 KB

english, 1995

37

AIP Conference Proceedings [AIP STRESS-INDUCED PHENOMENA IN METALLIZATION: 11th International Workshop - Bad Schandau, (Germany) (12–14 April 2010)] - Influence Of The Activation Energy Of The Different Migration Effects On Failure Locations In Metallization

Weide-Zaage, Kirsten, Ciptokusumo, Joharsyah, Aubel, Oliver, Zschech, Ehrenfried, Ogawa, Shinichi, Ho, Paul S.

Year:

2010

Language:

english

File:

PDF, 1.45 MB

english, 2010

38

[IEEE 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hannover, Germany (2019.3.24-2019.3.27)] 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Simulations in Terms of Radiation Effects on different BEOL Material Systems

Weide-Zaage, Kirsten, Paya-Vaya, Guillermo, Eichin, Philemon

Year:

2019

Language:

english

File:

PDF, 336 KB

english, 2019

39

[IEEE 2013 IEEE International Integrated Reliability Workshop (IIRW) - South Lake Tahoe, CA, USA (2013.10.13-2013.10.17)] 2013 IEEE International Integrated Reliability Workshop Final Report - Overlap design for higher tungsten via robustness in AlCu metallizations

Kludt, Jorg, Weide-Zaage, Kirsten, Ackermann, Markus, Hein, Verena

Year:

2013

Language:

english

File:

PDF, 2.56 MB

english, 2013

40

[IEEE 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Toulouse (2018.4.15-2018.4.18)] 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Thick AlCu-metal reliability characterization

Weide-Zaage, Kirsten, Tan, Yuqi, Hein, Verena

Year:

2018

Language:

english

File:

PDF, 638 KB

english, 2018

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